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Surface Mount Technology (SMT)

Introduction to Surface Mount Technology (SMT)

Surface Mount Technology (SMT) is practice of soldering or mounting surface

Surface Mount Technology (SMT)

Surface Mount Technology (SMT)

mount devices (SMD) on the surface of a printed circuit board (PCB). The principle behind surface mount technology is different from the conventional soldering process to solder thru-hole electronic components. This comparatively new technology uses different soldering principles and equipments. Also the process is little more complex than thru-hole technology but offers better reliability and electrical conductivity.

What is Surface Mount Technology?

In Electronics, Surface Mount Technology is a soldering technology where surface mount electronic components, also known as surface mount devices (SMD) are mounted or soldered on the surface of the printed circuit board. This technology uses solder paste in place of solder wire or solder bar that is used in thru-hole soldering process.

SMT is mostly done using surface mount soldering equipment even though hand soldering is also done occasionally. Most manufacturing units using surface mount technology are cleanroom and ESD-Safe because most SMD electronic components, like semiconductors, are very sensitive to static charge. The cleanroom environment prevents these components from getting damaged because of static electricity.

Benefits of Surface Mount Technology

Surface mount technology offers benefits in terms of design and manufacturing.Design-related benefits of SMT include savings in weight and real estate and electrical noise reduction. SMT also provides improved shock and vibration resistance as a result of the lower mass of components. Manufacturing benefits of SMT include reduced board cost, reduced material handling cost, and a controlled manufacturing process.

What is SMD?

SMD stands for Surface Mount Device. These are electronic components have no leads like thru-hole components. These devices have tiny metallic legs very close to the surface of the components. These metallic legs are soldered on the copper tracing on the PCB using solder paste. BGA or Ball Grid Array is also a kind of SMD with no leads or legs at all. These special electronic components have tiny metallic spots underneath the components. They are soldered on the PCB using solder balls.

SMD Electronic Components

SMD Electronic Components

SMD Electronic Components

Most common SMD electronic components are:

SMD Passive Surface Mount Electronic Components for SMT -

  • Surface Mount Discrete Resistors
  • Surface Mount Resistor Networks
  • Ceramic Capacitors for SMT
  • Surface Mount Tantalum Capacitors
  • Tubular Passive Components for SMT

SMD Active Surface Mount Electronic Components for SMT –

  • Leadless Ceramic Chip Carriers (LCCC)
  • Small Outline Transistors (SOT)
  • Small Outline Integrated Circuit (SOIC and SOP)
  • Plastic Leaded Chip Carriers (PLCC)
  • Small Outline J Packages (SOJ)
  • Fine Pitch SMD Packages (QFP, SQFP)
  • Ball Grid Array (BGA)

Surface Mount Technology Equipment

SMT Equipment

SMT Equipment

Surface mount equipment are different from equipment used in thru-hole soldering. There can be a number of SMT equipment but the most common of them are:

  • SMT Solder Paste Screen Printer: A solder paste screen printer for SMT is needed to screen solder paste onto the printed circuit board (PCB) before placement of surface mount components.
  • SMT Pick-and-Place Machine: A pick-and-place machine picks and places SMD electronic components onto the PCB prior to soldering.
  • SMT Reflow Soldering Equipment: A reflow soldering equipment / machine is the second major equipment after pick-and-place machine in any SMT line.
  • SMT Curing / Baking Oven: An oven is required for both adhesive curing and solder paste baking operations. The same or different ovens may be used for adhesive curing and baking of solder paste.
  • SMT Solvent Cleaning Equipment: After soldering, the electronic assemblies must be cleaned to remove the flux and flux residues. The selection of solvent and cleaning equipment depends of the flux used and the cleanliness requirements.
  • SMT Repair and Inspection Equipment: There are two main types of automated inspection equipment on the market: x-ray and laser. However, most electronic companies depend on visual inspection at 2 to 10X, using either microscope of magnifying lamp.

SMT Magazine and SMTA (Surface Mount Technology Association)

SMT magazine is an online magazine dedicated to old, latest and upcoming developments in the field of surface mount technology. It publishes news and Information for and about the global printed circuit board industry. SMTA is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

Implementing SMT in Production Line for Manufacturing

Implementing SMT in production line needs some study and research. Without proper study and research, any SMT production line bears the risk of failure and increased cost. There are SMT experts who offer classes and tutorial on proper implementation and use of SMT. Not all electronic components are available in SMD. So thru-hole soldering technology is bound to exist. Combining SMT and thru-hole technology for successful PCB assembly is a challenge. So, manufacturers and engineers should do their study and research and take expert classes to avoid failure and increased cost.

SMTA – Surface Mount Technology (SMT) Association

SMTA – Surface Mount Technology (SMT) Association – SMTA stands for SurfaceMount Technology Association. It is an association of electronics professionals, experts, manufacturers and electronics and technology students related and associated with Surface Mount Technology.

SMTA LOGO

SMTA LOGO

SMTAI stands for SMTA International. This association offers focused technical solutions from today’s experts and leading suppliers in the electronics assembly industry.

Read : SMTA

SMT Thermal Design Considerations

When considering design for Surface Mount Technology (SMT), one must follow land pattern standards and thermal considerations to avoid thermal mismatch or CTE mismatch. Thermal problems in SMT increases with increase in number of SMD of the PCB.

Therefore, it is the responsibility of the designer to consider all the pros and cons of designing the board in SMT. It is very important to follow specific guidelines and rules.

SMT Thermal Mismatch

SMT Thermal Mismatch

While designing a PCB for SMT, it is important to consider land pattern design for all types ofsurface mount electronic components including passive and active components like – resistor, capacitor, MELF, SOP, QFP, BGA, QFN and SON etc.

IPC standard provides printed board designers with an intelligent land pattern naming convention, zero component rotations for CAD systems and three separate land pattern geometries for each component that allow the user to select a land pattern based on desired component density.

Read: Surface Mount Design Considerations in SMT & CTE Mismatching

SMT Definition – What is Surface Mount Technology

SMT or Surface Mount Technology is an advanced technology in electronics to assemble or solder surface mount electronic components onto printed circuit board.

SMT electronic components do not have leads like thru-hole electronic

SMT Electronic Components

SMT Electronic Components

components. They have flat legs that can be soldered on the surface of the PCB and hence the name Surface Mount Technology. Common SMD (Surface Mount Devices) include – CLCC, MELF, SOIC, LCCC, PLCC, CLCC, SOT, SOIC, SOP, SOJ, QFP, SQFP, BGA.

Equipment needed in surface mount technology are different from that of thru-hole PCB assembly line. Common SMT Equipment include – solder paste screen printer, reflow oven, solven cleaning equipment, inspection and repair equipment etc.

ReadSMT Dictionary

SMT PCB Assembly

Assembly or soldering or Surface Mount PCB is different from assembly or

A Complete SMT Assembly Equipment

A Complete SMT Assembly Equipment

soldering or thru-hole. Starting from PCBelectronic components, soldering and components placement machine and equipment and soldering material including solder paste, many other things and techniques in SMT assembly line are different from a traditional thru-hole PCB assembly line.

A SMT PCB assembly line has to be cleanroomSMT in Assembly Line for Manufacturing and Production of Surface Mount PCB Assembly need equipment like:

  1. SMT Pick and Place Equipment.
  2. Solder Paste Screen Printer.
  3. Reflow Oven.
  4. Solvent Cleaning Equipment.
  5. Repair and Inspection Equipment.

ReadSMT in Assembly Line for Manufacturing and Production of Surface Mount PCB Assembly

Advantages of Surface Mount Technology

Surface Mount Technology or SMT and many advantages or benefits over

SMT PCB

SMT PCB

thru-hole technology. When we are talking about advantages of SMT, it doesn’t means that there is no disadvantage associated with Surface Mount Technology. Every technology in the world has some advantage and some disadvantage. But here we will discuss only about the advantages of SMT over thru-hole.

Following are some of the major advantages of SMT over Thru-Hole:

  1. Surface Mount Devices or SMT electronic comp0nents are much smaller in size as compared to thru-hole and hence they occupy lesser space on the PCB.
  2. A single SMT components can perform multiple tasks. There are high-end SMT components.
  3. Since SMT electronic components are mounted over the Printed Circuit Board, there is no or less need to drill home in the PCB.
  4. PCB Assembly for SMT is much simple and automated as compared to thru-hole.
  5. SMT components can be soldered on both sides of the PCB.
  6. There is Lower resistance and inductance at the connection leading to better performance.
  7. SMT PCB Assembly is more resistant to shakes and vibrations.

Read More onBenefits and Advantages of Surface Mount Technology

SMT Troubleshooting Guide

SMT or Surface Mount Technology is not 100% error-free. There are problems

SMT Defects

SMT Defects

and manufacturing and operational defects in both thru-home and SMT. There problems could be with SMD electronic components, SMT Printed Circuit Board or SMT Soldering or even thermal mismatch.

Many electronicmanufacturers around the world are new to surface mount technology or SMT and lead-free soldering. They are bound to make mistakes. These issues, mistakes or errors need troubleshooting.

Read the following Easy-to-use advice and SMT troubleshooting guide for common SMT PCB assembly issues, problems and solutions : SMT Troubleshooting

SMD Soldering

SMD Soldering technology and techniques used in Electronics is little

SMD Soldering

SMD Soldering

different from soldering technology and techniques used to solder through-hole components on to the PCB.

In SMD Soldering, SMT Equipments and Solder Paste andSolder Flux used is different.

In SMD Soldering, the solder is either in the form of Solder Paste or BGA. Solder wire is also used in SMD soldering, mainly in SMD Rework / Repair.

In high-end mass manufacturing, assembly and production of SMT Equipments may include, Wave Soldering MachineReflow OvenPick-and-Place EquipmentSolder Paste Screen Printer,  SMT Solvent Cleaning Equipment and  Repair and Inspection Equipments for SMT.

For SMT Rework and Repair, Hot air SMD Rework Systems and Soldering Irons such as Weller Soldering Stations and Soldering Irons may be used.

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