As an experimental-grade reflow soldering equipment, the Desktop Reflow Oven machine has the following core features and functions: Core Features Compact Modular Design Adopting a drawer-type structure, it has a desktop-sized volume that saves space, is easy to maintain, and supports non-standard customisation. Precise Temperature Control Technology Independent temperature zone control (±2°C accuracy), with a maximum temperature difference of 100°C between adjacent zones without temperature crossover. Infrared uniform heating combined with an independent small-cycle air circulation system, enabling rapid thermal compensation (temperature difference <5°C). High-performance configuration Patented heating wire technology achieves rapid heating in 20 minutes, reducing energy consumption by 30%. Optional forced cooling and flux recovery systems are available to meet environmental requirements.