Vacuum reflow soldering, as an advanced soldering technology, plays a crucial role in multiple aspects: Prevents oxidation of solder joints, ensuring robust and reliable soldering, and enhancing overall soldering quality. Utilises vacuum pressure differences to remove bubbles from molten solder, significantly reducing porosity (to below 10%, and as low as 3–5% under optimal conditions), thereby improving the density and purity of solder joints. Improving the electrical conductivity, thermal conductivity, mechanical strength, sealing performance, and pressure resistance of solder joints, thereby enhancing device reliability. Reducing soldering defects (such as porosity or impurities), preventing damage to chips and substrates, and improving product yield. Enabling flux-free soldering, reducing environmental pollution and environmental protection costs. Minimising thermal stress through precise temperature control (such as infrared uniform heating), ensuring uniform solder melting and avoiding overheating issues. Easy to operate and learn, improving production efficiency and adapting to diverse application scenarios (such as high-density packaging of chip capacitors, inductors, etc.) Widely applied in high-reliability fields such as aerospace, military electronics, medical devices, and automotive electronics, meeting stringent quality requirements
