The speed-adjustable solder paste mixer is an automated device specifically designed for the electronics manufacturing industry. Its core function is to achieve uniform mixing and bubble elimination of solder paste (a mixture of tin powder and flux paste) by precisely controlling mixing speed and time, ensuring its stability and reliability in the SMT printing process.
Adjustable Speed Function
Utilising stepless speed control technology, the mixing speed can be flexibly adjusted according to the physical properties of the solder paste, such as viscosity and density. High-viscosity solder paste typically requires higher speeds to achieve thorough mixing.
Supports precise parameter settings (e.g., speed, time) to accommodate the mixing requirements of different brands or models of solder paste.
Efficient mixing and degassing
Utilising a composite centrifugal mixing principle combining orbital and rotational motion (simulating planetary motion), the machine achieves uniform dispersion of solder paste particles in a sealed environment while effectively eliminating bubbles, thereby avoiding the risks of oxidation or moisture absorption associated with manual mixing.
Some models support vacuum degassing functionality to further enhance mixing quality.
