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Tin paste management machine /CYG-SPG3C300-A/600-A
Tin paste management machine /CYG-SPG3C300-A/600-A
Specifications
technical parameter :
Equipment size: 1800 (L) *1750 (W) *2100mm (H)
Net weight: 800~1000kg
Refrigeration capacity of the refrigerator: 1.5~2kw
Refrigeration capacity of the refrigerator: 1.5kw
Refrigeration box temperature: 1~10℃ (can be freely set)
Refrigeration box capacity: 300pcs or 600pcsRecovery zone temperature: 18-28℃ (room temperature
Description
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The SMT industry faces significant waste and operational chaos caused by manual solder paste management, particularly when human oversight leads to substandard final product quality. Implementing automated solder paste management systems that follow a first-in-first-out (FIFO) principle not only optimizes labor efficiency but also ensures production quality through real-time data tracking. This approach effectively prevents defective solder paste from being used in manufacturing due to insufficient or excessive reflow time, thereby guaranteeing optimal soldering performance in end products.
Due to the high daily demand for tin paste in bottles, the automatic storage system has to handle a large amount of tin paste storage. Over the years, the automatic tin paste storage system has faced technical challenges such as limited storage capacity and lack of positioning features, leading to high manufacturing costs. As a result, domestic SMT factories have remained reluctant to adopt manual management.
The traditional solder paste storage and retrieval are managed manually, and the OP randomly takes and puts the solder paste, resulting in waste. It is difficult to track the use data of the solder paste manually, which may cause defects in the final products welded.
Time process control and quality management during the use of solder paste can reduce the influence of human factors on the quality of solder paste. At the same time, one equipment can meet the requirements of multiple production lines at the same time, which can save the cost of manual control.
· Equipment features and advantages:
A. Automatic refrigeration, rewarming, stirring, material distribution, online appointment for rewarming, automatic scrap when time exceeds.
b. The system can trace every bottle of solder paste: input, refrigeration, reheat, stirring, material taking time, refrigeration temperature and other whole-process information management.
c. Can store a variety of solder pastes, with a design capacity of 300 cans or 600 cans, and control FIFO according to Date code.
d. Can be rewarmed for a variety of solder pastes, with a single capacity up to 45 bottles.
e. Can stir 1 or 2 cans of solder paste at the same time, and can set different speeds and time.
f. Support the operator identity authentication function (fingerprint/password), and solder paste is managed by a special person.
 
 basic function :
Automatic storage, back temperature, stirring and material distribution; support online appointment for solder paste back temperature and collection, refrigeration timeout and back temperature timeout solder paste is automatically scrapped.
 
Data tracking:
Connect with customer MES/SFCS system, scan code for warehousing, out of the warehouse, return temperature, mixing, material retrieval, material input time, refrigeration time, return time, mixing time, material retrieval time, storage and use information, refrigeration temperature and other whole-process data tracking and storage, information management.
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