GL-300 BGA rework station
GL-e5860C BGA rework station is of touch screen,high precision and high quality
It is good at repairing all kinds of bga chip sets from laptop, desktop, computer and so on.
G.W. is appox 60KG. Package dimension is L600*W600*H750mm.
Warranty: 1 year.
Delivery time is 15 days after confirmed order.
Specifications
PCB dimension: W20*D20~W350*D350mm
PCB thinkness: 0.5~4mm
BGA dimension: 1*1~70*70mm
Working table adjustment: ±10MM forward/backward,±10MM left/right
Lower hot-air heater: 1000W
Upper hot-air heater: 1000W
Bottom preheatfar infrared: 3000W
Temperatur control: K-type thermocoupleclose cycle controlled
PCB locating way: Outer or Jig
Min pitch of BGA ball:0.15mm
Placement precision:±0.02mm
Max BGA weight:300g
Power supply: single-phase 220V,50/60Hz,4.5KW
Machine dimension: L600*W600*H750mm
Weight: Appox 60Kgs
